TY - GEN
T1 - Surface EMG multichannel array using active dry sensors for forearm signal extraction
AU - Reategui, Julio
AU - Callupe, Rocio
N1 - Publisher Copyright:
© 2017 IEEE.
PY - 2017/10/20
Y1 - 2017/10/20
N2 - Although superficial electromyographic signals are the most common input signal for machine learning algorithms in hand gesture recognition and finger force estimation applications, there are only a few commercially available systems for superficial EMG acquisition. This work proposes a cheap and easy to fabricate, dry superficial electrodes array. This system uses multiple active differential sensors integrated in a small double layer PCBs, each one uses two small rectangle areas of the bottom layer as conductive layer for signal acquisition. With a differential gain of 60dB between 23 and 3000Hz and a common mode rejection ration of -60dB at 60Hz. Design criteria and simulations are presented.
AB - Although superficial electromyographic signals are the most common input signal for machine learning algorithms in hand gesture recognition and finger force estimation applications, there are only a few commercially available systems for superficial EMG acquisition. This work proposes a cheap and easy to fabricate, dry superficial electrodes array. This system uses multiple active differential sensors integrated in a small double layer PCBs, each one uses two small rectangle areas of the bottom layer as conductive layer for signal acquisition. With a differential gain of 60dB between 23 and 3000Hz and a common mode rejection ration of -60dB at 60Hz. Design criteria and simulations are presented.
UR - http://www.scopus.com/inward/record.url?scp=85040013767&partnerID=8YFLogxK
U2 - 10.1109/INTERCON.2017.8079699
DO - 10.1109/INTERCON.2017.8079699
M3 - Conference contribution
AN - SCOPUS:85040013767
T3 - Proceedings of the 2017 IEEE 24th International Congress on Electronics, Electrical Engineering and Computing, INTERCON 2017
BT - Proceedings of the 2017 IEEE 24th International Congress on Electronics, Electrical Engineering and Computing, INTERCON 2017
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 24th IEEE International Congress on Electronics, Electrical Engineering and Computing, INTERCON 2017
Y2 - 15 August 2017 through 18 August 2017
ER -