TY - GEN
T1 - S-band koch snowflake fractal antenna for cubesats
AU - Palacios, Orlando Francois Gonzales
AU - Diaz Vargas, Ricardo Erick
AU - Perez, Jorge Arturo Heraud
AU - Erazo, Segundo Basilio Correa
N1 - Publisher Copyright:
© 2016 IEEE.
PY - 2017/1/27
Y1 - 2017/1/27
N2 - This paper presents the design, simulation and implementation of a novel Koch curve fractal antenna, developed according to the second iteration of the Koch snowflake fractal for 2.3 GHz, 2.4 GHz and 2.45 GHz. The measurements of the simulated and fabricated antenna show good agreement for the operating frequencies and desirable performance in gain, bandwidth and VSWR parameters. Being a compact antenna, it has a size, geometry and characteristics that go in accord to CubeSat's structure standards. The antenna was fabricated on a 1.5 mm thick FR-4 substrate. The VSWR achieved values are lower than 1.4 for the frequencies used. Additionally, the simulated radiation pattern is omnidirectional and shows good gain and directivity. A maximum gain of 4.39 dBi was achieved.
AB - This paper presents the design, simulation and implementation of a novel Koch curve fractal antenna, developed according to the second iteration of the Koch snowflake fractal for 2.3 GHz, 2.4 GHz and 2.45 GHz. The measurements of the simulated and fabricated antenna show good agreement for the operating frequencies and desirable performance in gain, bandwidth and VSWR parameters. Being a compact antenna, it has a size, geometry and characteristics that go in accord to CubeSat's structure standards. The antenna was fabricated on a 1.5 mm thick FR-4 substrate. The VSWR achieved values are lower than 1.4 for the frequencies used. Additionally, the simulated radiation pattern is omnidirectional and shows good gain and directivity. A maximum gain of 4.39 dBi was achieved.
KW - 2.3 GHz
KW - CubeSat
KW - FR-4
KW - Fractal
KW - Koch snowflake
KW - S-Band
UR - http://www.scopus.com/inward/record.url?scp=85015245666&partnerID=8YFLogxK
U2 - 10.1109/ANDESCON.2016.7836227
DO - 10.1109/ANDESCON.2016.7836227
M3 - Conference contribution
AN - SCOPUS:85015245666
T3 - Proceedings of the 2016 IEEE ANDESCON, ANDESCON 2016
BT - Proceedings of the 2016 IEEE ANDESCON, ANDESCON 2016
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2016 IEEE ANDESCON, ANDESCON 2016
Y2 - 19 October 2016 through 21 October 2016
ER -