@inproceedings{427474b1e76b4aabb2627d8471f935a9,
title = "Real-Time EMG Classification for Bipedal Robot Control: A Hands-On Educational Platform",
abstract = "A hands-on educational platform is presented for teaching biosignal processing, machine learning, and robotics through real-time control of a bipedal robot using electromyo-graphic (EMG) signals. Lower-limb EMG signals are captured using Delsys sensors and processed on a Raspberry Pi, where relevant features are extracted and classified using a K-Nearest Neighbors (KNN) algorithm. The recognized movements are then mapped to motor commands and transmitted to an Arduino-based controller that actuates the bipedal robot. The system is designed to create a demonstrative module for hands-on learning in biomedical engineering and robotics education. Experimental results demonstrate reliable physical execution of learned movements with the implemented algorithm. By integrating signal acquisition, real-time classification, and robotic control, this platform provides a practical and engaging approach for students to explore human-machine interfaces.",
keywords = "biomedical signal processing, bipedal robot, educational module, Electromyography, K-Nearest Neighbors",
author = "Cespedes, \{Ana V.\} and Ramirez, \{Diego A.\} and Abarca, \{Victoria E.\} and Elias, \{Dante A.\}",
note = "Publisher Copyright: {\textcopyright} 2025 IEEE.; 32nd IEEE International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2025 ; Conference date: 20-08-2025 Through 22-08-2025",
year = "2025",
doi = "10.1109/INTERCON67304.2025.11244692",
language = "English",
series = "Proceedings of the 2025 IEEE 32nd International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2025",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
editor = "Ramirez, \{Gianpierre Zapata\} and Ibanez, \{Carlos Raymundo\} and Arias, \{Heyul Chavez\}",
booktitle = "Proceedings of the 2025 IEEE 32nd International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2025",
}