Interferograms analysis for measuring the thickness of aluminum thin films

Ivan Choque, Miguel Asmad, Josue Miranda, Alberto Quispe

Producción científica: Capítulo del libro/informe/acta de congresoContribución a la conferenciarevisión exhaustiva

Resumen

In this work, a specific procedure to measure the thickness of aluminum thin films by interferogram analysis is described. Six interferograms correspond to the image of the aluminum thin film superimposed with interference fringes are obtained from a Michelson-type interferential microscope. A six-frame phase shift algorithm is used to demodulate the optical phase. The measured phase is proportional to the height variation between the thin film wafer and the substrate. Finally, the obtained 3D height map permits us measure the thickness of the sample over an area of 1024 µm × 1280 µm.

Idioma originalInglés
Título de la publicación alojadaOptical Measurement Systems for Industrial Inspection XIII
EditoresPeter Lehmann
EditorialSPIE
ISBN (versión digital)9781510664456
DOI
EstadoPublicada - 2023
EventoOptical Measurement Systems for Industrial Inspection XIII 2023 - Munich, Alemania
Duración: 26 jun. 202329 jun. 2023

Serie de la publicación

NombreProceedings of SPIE - The International Society for Optical Engineering
Volumen12618
ISSN (versión impresa)0277-786X
ISSN (versión digital)1996-756X

Conferencia

ConferenciaOptical Measurement Systems for Industrial Inspection XIII 2023
País/TerritorioAlemania
CiudadMunich
Período26/06/2329/06/23

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