Design and Implementation of the Electronic Domain of a 1 DOF Bilateral Teleoperation System Considering Submerged Environments

Claudia R. Pauyac Estrada, Pablo Cardenas Caceres

Producción científica: Capítulo del libro/informe/acta de congresoContribución a la conferenciarevisión exhaustiva

Resumen

Teleoperation systems are presented as solutions in research areas that focus on activities for which the human being is not physically prepared, due to the dangers that exist in the environment in which they are developed. However, in most of these systems, control algorithms lack a bilateral feature, i.e., the operator, who is in a remote space, is unaware of how much effort is being applied in the local environment, as no interaction with the environment is being perceived. In recent years, the need has arisen to design teleoperation systems that can be used in underwater environments, since underwater activities, such as underwater archaeology, flora and fauna exploration, and more, have several limitations in the execution of missions. In this work is presented the design methodology present in the development of the electronics involved in a 1 DOF (Degrees of Freedom) bilateral teleoperation platform that can be used in underwater environments; this allows the execution of bilateral control algorithms and considers the mechanical design of the system. The electronic design is validated so that it can be used in future research.

Idioma originalInglés
Título de la publicación alojadaProceedings of the 2023 IEEE 30th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2023
EditorialInstitute of Electrical and Electronics Engineers Inc.
ISBN (versión digital)9798350315578
DOI
EstadoPublicada - 2023
Evento30th IEEE International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2023 - Lima, Perú
Duración: 2 nov. 20234 nov. 2023

Serie de la publicación

NombreProceedings of the 2023 IEEE 30th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2023

Conferencia

Conferencia30th IEEE International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2023
País/TerritorioPerú
CiudadLima
Período2/11/234/11/23

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