Design and Implementation of an Inspection Robot for Crack Detection in Flooded Pipes

Jans Solano, Jimm Cisneros, Lucia Sarmiento, Henry Quispe, Albert Hermitano, Diego Quiroz, Jose Balbuena

Producción científica: Capítulo del libro/informe/acta de congresoContribución a la conferenciarevisión exhaustiva

Resumen

The pipeline used to supply drinking water to Andean communities is a crucial component of the water management project in mining complexes that aims to preserve local resources. However, the degraded state of the pipeline poses significant environmental, social and economic risks. To overcome these challenges, the present work proposes the development of a teleoperated robot for the inspection of flooded pipelines. The vehicle features an IP68 protection system to ensure underwater operation, along with measurement and analysis capabilities to assess the pipeline profile. In addition, it incorporates real-time video transmission and visual inspection aids through a graphical interface. Effective communication is ensured within a distance of 600 meters between the vehicle and the command post with a latency of less than 100 ms. Furthermore, an important aspect of this work is the successful segmentation of cracks and fissures using a hybrid CNN-RNN architecture, trained on a dataset comprising online repository images and images captured inside the pipeline.

Idioma originalInglés
Título de la publicación alojadaProceedings of the 2023 IEEE 30th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2023
EditorialInstitute of Electrical and Electronics Engineers Inc.
ISBN (versión digital)9798350315578
DOI
EstadoPublicada - 2023
Evento30th IEEE International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2023 - Lima, Perú
Duración: 2 nov. 20234 nov. 2023

Serie de la publicación

NombreProceedings of the 2023 IEEE 30th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2023

Conferencia

Conferencia30th IEEE International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2023
País/TerritorioPerú
CiudadLima
Período2/11/234/11/23

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