Design and implementation of a low-cost non-invasive modular kit for wheelchairmotorization in developing countries

Anthony Valladolid-Ballon, Jesus Flores-Oscanoa, Richard Kevin Revilla-Segovia, Brayan Yordy Astete-Florez, Daniel Lavayen-Farfan, Carlos Fosca-Pastor

Producción científica: Capítulo del libro/informe/acta de congresoContribución a la conferenciarevisión exhaustiva

Resumen

Wheelchairs are essential for people with reduced mobility. Motorization of these devices can provide an increase quality of living and independence for their users. However, the cost of electric wheelchairs makes them inaccessible to users from developing countries. To address this issue, a low-cost modular kit is proposed, designed and manufactured. The mechatronic design of the kit includes the mechanical design of the components as well as dimensioning, the selection of electronic components, as well as the incorporation of IoT technology to be able to control it using a smartphone if necessary. The resulting modular kit proves to be useful as it can be rapidly installed on a commercial wheelchair without modifying its structure. Preliminary tests of the functional prototype show the wheelchair can provide enhanced mobility to the user, a low turning radius for narrow spaces, as wells as the ability to easily climb up and down on ramps.

Idioma originalInglés
Título de la publicación alojadaProceedings of the 2024 IEEE 31st International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2024
EditorialInstitute of Electrical and Electronics Engineers Inc.
ISBN (versión digital)9798350378344
DOI
EstadoPublicada - 2024
Evento31st IEEE International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2024 - Lima, Perú
Duración: 6 nov. 20248 nov. 2024

Serie de la publicación

NombreProceedings of the 2024 IEEE 31st International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2024

Conferencia

Conferencia31st IEEE International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2024
País/TerritorioPerú
CiudadLima
Período6/11/248/11/24

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