TY - GEN
T1 - Color estimation using nanowires sensors
AU - Barbaran, Juan Carlos
AU - Murray, Victor
AU - Wober, Munib
AU - Habbal, Fawwaz
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/8
Y1 - 2019/8
N2 - In the last years, the use of multispectral cameras have been increasing due to their ability to analyze different characteristics of materials. Thus, multiples methods to develop cameras with multispectral filters arrays have been studied. These cameras must always have the option to combine the multispectral information to create a regular color image. In this work, we present a method to estimate the regular colors from a novel prototype of a multispectral camera that been developed using nanowires sensors. Real information from nine frequencies are analyzed using classification and regression methods.
AB - In the last years, the use of multispectral cameras have been increasing due to their ability to analyze different characteristics of materials. Thus, multiples methods to develop cameras with multispectral filters arrays have been studied. These cameras must always have the option to combine the multispectral information to create a regular color image. In this work, we present a method to estimate the regular colors from a novel prototype of a multispectral camera that been developed using nanowires sensors. Real information from nine frequencies are analyzed using classification and regression methods.
KW - Color estimation
KW - Multispectral cameras
KW - Multispectral filter arrays
UR - http://www.scopus.com/inward/record.url?scp=85073549600&partnerID=8YFLogxK
U2 - 10.1109/INTERCON.2019.8853559
DO - 10.1109/INTERCON.2019.8853559
M3 - Conference contribution
AN - SCOPUS:85073549600
T3 - Proceedings of the 2019 IEEE 26th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2019
BT - Proceedings of the 2019 IEEE 26th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 26th IEEE International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2019
Y2 - 12 August 2019 through 14 August 2019
ER -