TY - GEN
T1 - A first approach to multispectral high-dynamic-range imaging using nanowires sensors
AU - Barbaran, Juan Carlos
AU - Murray, Victor
AU - Wober, Munib
AU - Habbal, Fawwaz
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/8
Y1 - 2019/8
N2 - In the last years, the use of multispectral images in different applications has been increasing due to access to industrial multispectral cameras that can analyze the composition of different materials. In another scenario, the use of high-dynamic-range (HDR) imaging is not only related to different exposure times for analyzing the light but also to produce pretty pictures thanks to the access to portable cameras with HDR capabilities, like in the smartphones. In this work, we present a first approach to produce HDR images using nine spectral images acquired using a novel prototype of a multispectral camera using nanowires sensors. The methods analyzed were multiple linear regression, support vector machines, and the k-nearest neighbors algorithm. The approach is tested using a Macbeth chart of 24 colors and real, natural objects.
AB - In the last years, the use of multispectral images in different applications has been increasing due to access to industrial multispectral cameras that can analyze the composition of different materials. In another scenario, the use of high-dynamic-range (HDR) imaging is not only related to different exposure times for analyzing the light but also to produce pretty pictures thanks to the access to portable cameras with HDR capabilities, like in the smartphones. In this work, we present a first approach to produce HDR images using nine spectral images acquired using a novel prototype of a multispectral camera using nanowires sensors. The methods analyzed were multiple linear regression, support vector machines, and the k-nearest neighbors algorithm. The approach is tested using a Macbeth chart of 24 colors and real, natural objects.
KW - High-dynamic-range imaging
KW - Multispectral imaging
KW - Nanowires sensors
UR - http://www.scopus.com/inward/record.url?scp=85073519937&partnerID=8YFLogxK
U2 - 10.1109/INTERCON.2019.8853575
DO - 10.1109/INTERCON.2019.8853575
M3 - Conference contribution
AN - SCOPUS:85073519937
T3 - Proceedings of the 2019 IEEE 26th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2019
BT - Proceedings of the 2019 IEEE 26th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 26th IEEE International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2019
Y2 - 12 August 2019 through 14 August 2019
ER -