Interferograms analysis for measuring the thickness of aluminum thin films

Ivan Choque, Miguel Asmad, Josue Miranda, Alberto Quispe

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

In this work, a specific procedure to measure the thickness of aluminum thin films by interferogram analysis is described. Six interferograms correspond to the image of the aluminum thin film superimposed with interference fringes are obtained from a Michelson-type interferential microscope. A six-frame phase shift algorithm is used to demodulate the optical phase. The measured phase is proportional to the height variation between the thin film wafer and the substrate. Finally, the obtained 3D height map permits us measure the thickness of the sample over an area of 1024 µm × 1280 µm.

Original languageEnglish
Title of host publicationOptical Measurement Systems for Industrial Inspection XIII
EditorsPeter Lehmann
PublisherSPIE
ISBN (Electronic)9781510664456
DOIs
StatePublished - 2023
EventOptical Measurement Systems for Industrial Inspection XIII 2023 - Munich, Germany
Duration: 26 Jun 202329 Jun 2023

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume12618
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X

Conference

ConferenceOptical Measurement Systems for Industrial Inspection XIII 2023
Country/TerritoryGermany
CityMunich
Period26/06/2329/06/23

Keywords

  • Interferometry
  • interferogram
  • phase
  • thickness
  • topography

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